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? semiconductor components industries, llc, 2014 july, 2014 ? rev. 1 1 publication order number: ncs20071/d ncs20071, ncs20072, NCS20074 rail-to-rail output, 3 mhz bw operational amplifier the ncs2007 series operational amplifiers provide rail?to?rail output operation, 3 mhz bandwidth, and are available in single, dual, and quad configurations. rail?to?rail operation enables the user to make optimal use of the entire supply voltage range while taking advantage of 3 mhz bandwidth. the ncs2007 can operate on supply voltages as low as 2.7 v over the temperature range of ?40 c to 125 c. at a 2.7 v supply, the high bandwidth provides a slew rate of 2.8 v/ s while only consuming 405 a of quiescent current per channel. the wide supply range allows the ncs2007 to run on supply voltages as high as 36 v, making it ideal for a broad range of applications. since this is a cmos device, high input impedance and low bias currents make it ideal for interfacing to a wide variety of signal sensors. the ncs2007 devices are available in a variety of compact packages. features ? rail?to?rail output ? wide supply range: 2.7 v to 36 v ? wide bandwidth: 3 mhz typical at v s = 2.7 v ? high slew rate: 2.8 v/ s typical at v s = 2.7 v ? low supply current: 405 a per channel at v s = 2.7 v ? low input bias current: 5 pa typical ? wide temperature range: ?40 c to 125 c ? available in a variety of packages ? ncv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant applications ? current sensing ? signal conditioning ? automotive end products ? notebook computers ? portable instruments ? power supplies http://onsemi.com see detailed ordering and shipping information on page 4 o f this data sheet. ordering information 1 14 soic?14 nb case 751a sot?553 case 463b 1 5 tsop?5 case 483 micro8 case 846ah 1 8 soic?8 case 751 tssop?8 case 948s 1 8 udfn8 case 517ac 1 14 tssop?14 case 948g see general marking information in the device marking section on page 2 of this data sheet. device marking information
ncs20071, ncs20072, NCS20074 http://onsemi.com 2 soic?14 nb case 751a xxxxx awlyww 1 14 sot?553 case 463b xxm tsop?5 case 483 1 5 adyayw micro8 case 846ah xxx ymd soic?8 case 751 xxxxxx ayww 1 8 xxx yww a tssop?8 case 948s udfn8 case 517ac xx m 1 xxxx xxxx alyw 1 14 tssop?14 case 948g single channel configuration ncs20071, ncv20071 dual channel configuration ncs20072, ncv20072 quad channel configuration NCS20074, ncv20074 figure 1. marking diagrams x = specific device code a, r = assembly location y = year ww, w = work week g or = pb?free package
ncs20071, ncs20072, NCS20074 http://onsemi.com 3 1 4 3 2 14 11 12 13 out 1 in? 1 in+ 1 vdd out 4 in? 4 in+ 4 vss 7 6 5 8 9 10 in+ 2 in? 2 out 2 in+ 3 in? 3 out 3 + ? + ? ? + + ? figure 2. pin connections single channel configuration ncs20071, ncv20071 dual channel configuration ncs20072, ncv20072 quadruple channel configuration NCS20074, ncv20074 1 3 2 5 4 out in? in+ vss vdd + ? sot553?5 1 3 2 5 4 out in? in+ vss vdd + ? sot23?5 (tsop?5) 1 4 3 2 8 5 6 7 out 1 in? 1 in+ 1 vss vdd out 2 in? 2 in+ 2 + + ? ?
ncs20071, ncs20072, NCS20074 http://onsemi.com 4 ordering information device configuration automotive marking package shipping ? ncs20071sn2t1g* single no * sot23?5 (tsop?5) (pb?free) 3000 / tape and reel ncs20071* * sot553?5 (pb?free) 4000 / tape and reel ncv20071sn2t1g* yes * sot23?5 (tsop?5) (pb?free) 3000 / tape and reel ncv20071* * sot553?5 (pb?free) 4000 / tape and reel ncs20072dmr2g* dual no * micro8 (msop8) (pb?free) 4000 / tape and reel ncs20072dr2g* * soic?8 (pb?free) 2500 / tape and reel ncs20072dtbr2g* * tssop?8 (pb?free) 3000 / tape and reel ncs20072* * udfn8 (pb?free) 3000 / tape and reel ncv20072dmr2g* yes * micro8 (msop8) (pb?free) 4000 / tape and reel ncv20072dr2g* * soic?8 (pb?free) 2500 / tape and reel ncv20072dtbr2g* * tssop?8 (pb?free) 3000 / tape and reel ncv20072* * udfn8 (pb?free) 3000 / tape and reel NCS20074dr2g quad no NCS20074 soic?14 (pb?free) 2500 / tape and reel NCS20074dtbr2g ncs2 0074 tssop?14 (pb?free) 2500 / tape and reel ncv20074dr2g yes NCS20074 soic?14 (pb?free) 2500 / tape and reel ncv20074dtbr2g ncs2 0074 tssop?14 (pb?free) 2500 / tape and reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *contact local sales office for more information
ncs20071, ncs20072, NCS20074 http://onsemi.com 5 absolute maximum ratings (note 1) rating symbol limit unit supply voltage (v dd ? v ss ) (note 2) v s 40 v input voltage v i v ss ? 0.2 to v dd + 0.2 v differential input voltage v id v s v maximum input current i i 10 ma maximum output current i o 100 ma continuous total power dissipation (note 2) p d 200 mw maximum junction temperature t j 150 c storage temperature range t stg ?65 to 150 c mounting temperature (infrared or convection ? 20 sec) t mount 260 c esd capability (note 3) human body model machine model charged device model esd hbm esd mm esd cdm 2000 150 1000 (c6) v latch?up current (note 3) i lu 100 ma moisture sensitivity level (note 3) msl level 1 stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. refer to electrical characteristics and application information for safe operating area. 2. continuous short circuit operation to ground at elevated ambient temperature can result in exceeding the maximum allowed junc tion temperature of 150 c. output currents in excess of the maximum output current rating over the long term may adversely affect reliability. shorting output to either vdd or vss will adversely affect reliability. 3. this device series incorporates esd protection and is tested by the following methods: esd human body model tested per ansi/ansi/esda/jedec js-001?2010 (aec?q100?002) esd machine model tested per jesd22?a115 (aec?q100?003) esd charged device model tested per ansi/esd s5.3.1?2009 (aec?q100?011) 4. latch?up current tested per jedec standard: jesd78 (aec?q100?004) 5. moisture sensitivity level tested per ipc/jedec standard: j?std?020a thermal information parameter symbol package value unit junction?to?ambient ja sot23?5/ tsop5 235 c/w sot553?5 250 micro8/msop8 238 soic?8 190 tssop?8 140 udfn?8 350 soic?14 156 tssop?14 190 operating ranges parameter symbol min max unit operating supply voltage v s 2.7 36 v differential input voltage v id v s v input common mode range v icm v ss v dd ? 1.35 v ambient temperature t a ?40 125 c functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability.
ncs20071, ncs20072, NCS20074 http://onsemi.com 6 electrical characteristics at v s = 2.7 v t a = 25 c; r l 10 k ; v cm = v out = mid?supply unless otherwise noted. all limits are guaranteed by testing or statistical analysis. boldface limits apply over the specified temperature range, t a = ?40 c to 125 c. (notes 6, 7) parameter symbol conditions min typ max unit input characteristics input offset voltage v os 1.3 3 mv 4 mv offset voltage drift v os / t t a = 25 c to 125 c 2 v/ c input bias current i ib note 7 5 200 pa 1500 pa input offset current i os note 7 2 75 pa 175 pa channel separation xtlk dc 115 db differential input resistance r id 50 g common mode input resistance r in 5 g differential input capacitance c id 1.5 pf common mode input capacitance c cm 3.5 pf common mode rejection ratio cmrr v cm = 0 v to v dd ? 1.35 v 90 110 db 69 output characteristics open loop voltage gain a vol 96 118 db 86 output current capability i o op amp sinking current 70 ma op amp sourcing current 50 output voltage high v oh voltage output swing from positive rail 0.006 0.15 v 0.22 output voltage low v ol voltage output swing from negative rail 0.005 0.15 v 0.22 ac characteristics unity gain bandwidth ugbw c l = 25 pf 3 mhz slew rate at unity gain sr c l = 20 pf 2.8 v/ s phase margin m c l = 25 pf 50 gain margin a m c l = 25 pf 14 db settling time t s v o = 1 vpp, gain = 1, c l = 20 pf settling time to 0.1% 0.6 s settling time to 0.01% 1.2 noise characteristics total harmonic distortion plus noise thd+n v in = 0.5 vpp, f = 1 khz, av = 1 0.05 % input referred voltage noise e n f = 1 khz 30 nv/ h z f = 10 khz 20 input referred current noise i n f = 1 khz 0.25 fa/ hz product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 6. refer to absolute maximum ratings and application information for safe operating area. 7. performance guaranteed over the indicated operating temperature range by design and/or characterization.
ncs20071, ncs20072, NCS20074 http://onsemi.com 7 electrical characteristics at v s = 2.7 v t a = 25 c; r l 10 k ; v cm = v out = mid?supply unless otherwise noted. all limits are guaranteed by testing or statistical analysis. boldface limits apply over the specified temperature range, t a = ?40 c to 125 c. (notes 6, 7) parameter unit max typ min conditions symbol supply characteristics power supply rejection ratio psrr no load 114 135 db 100 power supply quiescent current i dd per channel, no load 405 525 a 625 product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 6. refer to absolute maximum ratings and application information for safe operating area. 7. performance guaranteed over the indicated operating temperature range by design and/or characterization. electrical characteristics at v s = 5 v t a = 25 c; r l 10 k ; v cm = v out = mid?supply unless otherwise noted. all limits are guaranteed by testing or statistical analysis. boldface limits apply over the specified temperature range, t a = ?40 c to 125 c. (notes 8, 9) parameter symbol conditions min typ max unit input characteristics input offset voltage v os 1.3 3 mv 4 mv offset voltage drift v os / t t a = 25 c to 125 c 2 v/ c input bias current i ib note 9 5 200 pa 1500 pa input offset current i os note 9 2 75 pa 175 pa channel separation xtlk dc 115 db differential input resistance r id 50 g common mode input resistance r in 5 g differential input capacitance c id 1.5 pf common mode input capacitance c cm 3.5 pf common mode rejection ratio cmrr v cm = 0 v to v dd ? 1.35 v 105 125 db 80 output characteristics open loop voltage gain a vol 96 120 db 86 output current capability i o op amp sinking current 50 ma op amp sourcing current 60 output voltage high v oh voltage output swing from positive rail 0.013 0.20 v 0.25 output voltage low v ol voltage output swing from negative rail 0.01 0.10 v 0.15 product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 8. refer to absolute maximum ratings and application information for safe operating area. 9. performance guaranteed over the indicated operating temperature range by design and/or characterization.
ncs20071, ncs20072, NCS20074 http://onsemi.com 8 electrical characteristics at v s = 5 v t a = 25 c; r l 10 k ; v cm = v out = mid?supply unless otherwise noted. all limits are guaranteed by testing or statistical analysis. boldface limits apply over the specified temperature range, t a = ?40 c to 125 c. (notes 8, 9) parameter unit max typ min conditions symbol ac characteristics unity gain bandwidth ugbw c l = 25 pf 3.2 mhz slew rate at unity gain sr c l = 2 0 pf 2.7 v/ s phase margin m c l = 25 pf 50 gain margin a m c l = 25 pf 14 db settling time t s v o = 3 vpp, gain = 1, c l = 20 pf settling time to 0.1% 1.2 s settling time to 0.01% 5.6 noise characteristics total harmonic distortion plus noise thd+n v in = 2.5 vpp, f = 1 khz, av = 1 0.009 % input referred voltage noise e n f = 1 khz 30 nv/ h z f = 10 khz 20 input referred current noise i n f = 1 khz 0.25 fa/ hz supply characteristics power supply rejection ratio psrr no load 114 135 db 100 power supply quiescent current i dd per channel, no load 410 530 a 630 product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 8. refer to absolute maximum ratings and application information for safe operating area. 9. performance guaranteed over the indicated operating temperature range by design and/or characterization. electrical characteristics at v s = 10 v t a = 25 c; r l 10 k ; v cm = v out = mid?supply unless otherwise noted. all limits are guaranteed by testing or statistical analysis. boldface limits apply over the specified temperature range, t a = ?40 c to 125 c. (notes 10, 11) parameter symbol conditions min typ max unit input characteristics input offset voltage v os 1.3 3 mv 4 mv offset voltage drift v os / t t a = 25 c to 125 c 2 v/ c input bias current i ib note 11 5 200 pa 1500 pa input offset current i os note 11 2 75 pa 175 pa channel separation xtlk dc 115 db differential input resistance r id 50 g common mode input resistance r in 5 g differential input capacitance c id 1.5 pf common mode input capacitance c cm 3.5 pf product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 10. refer to absolute maximum ratings and application information for safe operating area. 11. performance guaranteed over the indicated operating temperature range by design and/or characterization.
ncs20071, ncs20072, NCS20074 http://onsemi.com 9 electrical characteristics at v s = 10 v t a = 25 c; r l 10 k ; v cm = v out = mid?supply unless otherwise noted. all limits are guaranteed by testing or statistical analysis. boldface limits apply over the specified temperature range, t a = ?40 c to 125 c. (notes 10, 11) parameter unit max typ min conditions symbol input characteristics common mode rejection ratio cmrr v cm = 0 v to v dd ? 1.35 v 110 130 db 87 output characteristics open loop voltage gain a vol 98 120 db 88 output current capability i o op amp sinking current 50 ma op amp sourcing current 65 output voltage high v oh voltage output swing from positive rail 0.023 0.08 v 0.10 output voltage low v ol voltage output swing from negative rail 0.022 0.3 v 0.35 ac characteristics unity gain bandwidth ugbw c l = 25 pf 3.2 mhz slew rate at unity gain sr c l = 20 pf 2.2 v/ s phase margin m c l = 25 pf 50 gain margin a m c l = 25 pf 14 db settling time t s v o = 8.5 vpp, gain = 1, c l = 20 pf settling time to 0.1% 3.4 s settling time to 0.01% 6.8 noise characteristics total harmonic distortion plus noise thd+n v in = 7.5 vpp, f = 1 khz, av = 1 0.004 % input referred voltage noise e n f = 1 khz 30 nv/ h z f = 10 khz 20 input referred current noise i n f = 1 khz 0.25 fa/ hz supply characteristics power supply rejection ratio psrr no load 114 135 db 100 power supply quiescent current i dd per channel, no load 416 540 a 640 product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 10. refer to absolute maximum ratings and application information for safe operating area. 11. performance guaranteed over the indicated operating temperature range by design and/or characterization.
ncs20071, ncs20072, NCS20074 http://onsemi.com 10 electrical characteristics at v s = 36 v t a = 25 c; r l 10 k ; v cm = v out = mid?supply unless otherwise noted. all limits are guaranteed by testing or statistical analysis. boldface limits apply over the specified temperature range, t a = ?40 c to 125 c. (notes 12, 13) parameter symbol conditions min typ max unit input characteristics input offset voltage v os 1.3 3 mv 4 mv offset voltage drift v os / t t a = 25 c to 125 c 2 v/ c input bias current i ib note 13 5 200 pa 1500 pa input offset current i os note 13 2 75 pa 175 pa channel separation xtlk dc 115 db differential input resistance r id 50 g common mode input resistance r in 5 g differential input capacitance c id 1.5 pf common mode input capacitance c cm 3.5 pf common mode rejection ratio cmrr v cm = 0 v to v dd ? 1.35 v 120 145 db 95 output characteristics open loop voltage gain a vol 98 120 db 88 output current capability i o op amp sinking current 50 ma op amp sourcing current 65 output voltage high v oh voltage output swing from positive rail 0.074 0.10 v 0.12 output voltage low v ol voltage output swing from negative rail 0.065 0.3 v 0.35 ac characteristics unity gain bandwidth ugbw c l = 25 pf 3.2 mhz slew rate at unity gain sr c l = 20 pf 2.4 v/ s phase margin m c l = 25 pf 50 gain margin a m c l = 25 pf 14 db settling time t s v o = 10 vpp, gain = 1, c l = 20 pf settling time to 0.1% 3.2 s settling time to 0.01% 6.8 noise characteristics total harmonic distortion plus noise thd+n v in = 28.5 vpp, f = 1 khz, av = 1 0.001 % input referred voltage noise e n f = 1 khz 30 nv/ h z f = 10 khz 20 input referred current noise i n f = 1 khz 0.25 fa/ hz product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 12. refer to absolute maximum ratings and application information for safe operating area. 13. performance guaranteed over the indicated operating temperature range by design and/or characterization.
ncs20071, ncs20072, NCS20074 http://onsemi.com 11 electrical characteristics at v s = 36 v t a = 25 c; r l 10 k ; v cm = v out = mid?supply unless otherwise noted. all limits are guaranteed by testing or statistical analysis. boldface limits apply over the specified temperature range, t a = ?40 c to 125 c. (notes 12, 13) parameter unit max typ min conditions symbol supply characteristics power supply rejection ratio psrr no load 114 135 db 100 power supply quiescent current i dd per channel, no load 465 600 a 700 product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 12. refer to absolute maximum ratings and application information for safe operating area. 13. performance guaranteed over the indicated operating temperature range by design and/or characterization.
ncs20071, ncs20072, NCS20074 http://onsemi.com 12 0.7 0.6 0.5 0.4 0.3 0.2 supply voltage (v) 0 6 12 18 24 30 36 supply current (ma) figure 3. quiescent current per channel vs. supply voltage t = ?40 c t = 25 c t = 85 c t = 125 c 0.7 0.6 0.5 0.4 0.3 0.2 temperature ( c) ?40 ?20 20 40 60 80 120 supply current (ma) figure 4. quiescent current vs. temperature 0 100 v s = 10 v v s = 5 v v s = 2.7 v v s = 36 v 0 supply voltage (v) 0 6 12 18 24 30 36 offset voltage (mv) figure 5. offset voltage vs. supply voltage t = 125 c t = 25 c t = 85 c t = ?40 c ?0.2 ?0.4 ?0.6 ?0.8 ?1 ?1.2 v cm = mid?supply 5 common mode voltage (v) ?18 ?14 ?10 ?6 14 18 offset voltage (mv) figure 6. input offset voltage vs. common mode voltage 4 3 2 1 0 ?1 ?2 ?3 ?4 ?5 ?2 2 10 6 v s = 18 v 10 units 5 common mode voltage (v) 15.5 16 16.5 17 17.5 18 18.5 offset voltage (mv) figure 7. input offset voltage vs. common mode voltage 2.5 0 ?2.5 ?5 ?7.5 ?10 ?12.5 ?15 v s = 18 v 10 units normal operation v s = 2.7 v, gain v s = 36 v, gain v s = 2.7 v, phase v s = 36 v, phase 125 frequency (hz) 10 10m gain (db) figure 8. gain and phase vs. frequency 100 75 50 25 0 ?25 ?50 ?75 100 1k 10k 100k 1m 180 135 90 45 0 ?45 ?90 ?135 ?180 phase ( ) r l = 10 k c l = 15 pf gain phase
ncs20071, ncs20072, NCS20074 http://onsemi.com 13 60 capacitive load (pf) 0 100 200 300 400 500 phase margin ( ) figure 9. phase margin vs. capacitive load 50 40 30 20 10 0 1e+1 output voltage (vpp) 0 6 12 18 30 36 thd+n (%) figure 10. thd+n vs. output voltage 1e+0 1e?1 1e?2 1e?3 1e?4 24 frequency (hz) thd+n (%) figure 11. thd+n vs. frequency v s = 5 v r l = 10 k t a = 25 c v s = 36 v f in = 1 khz a v = 1 1e+1 1e+0 1e?1 1e?2 1e?3 1e?4 v s = 10 v v s = 5 v v s = 2.7 v v s = 36 v a v = 1 275 frequency (hz) voltage noise (nv/ hz ) figure 12. input voltage noise vs. frequency 250 225 200 175 150 125 100 75 50 25 0 frequency (hz) current noise (fa/ hz ) figure 13. input current noise vs. frequency 5 4 3 2 1 0 ?1 v s = 2.7 v v s = 5 v v s = 10 v v s = 36 v v s = 2.7 v v s = 5 v v s = 10 v v s = 36 v 140 frequency (hz) psrr (db) figure 14. psrr vs. frequency 120 100 80 60 40 20 0 v s = 2.7 v, v dd v s = 5 v, v ss v s = 10 v, v dd v s = 36 v v ss 10 100 1k 10k 10 100 1k 10k 100k 1m 10 100 1k 10k 100k 10 100 1k 10k 100k
ncs20071, ncs20072, NCS20074 http://onsemi.com 14 frequency (hz) cmrr (db) figure 15. cmrr vs. frequency 120 100 80 60 40 20 0 v s = 2.7 v v s = 5 v v s = 10 v v s = 36 v r l = 10 k t a = 25 c output current (ma) 02 46 18 output voltage from positive rail (v) figure 16. high level output vs. output current 1.4 20 t = ?40 c t = 25 c t = 85 c t = 125 c v s = 36 v 1.2 1 0.8 0.6 0.4 0.2 0 16 14 81012 t = ?40 c t = 25 c t = 85 c t = 125 c v s = 36 v output current (ma) output voltage from negative rail (v) figure 17. low level output vs. output current 1 0.8 0.6 0.4 0.2 0 0 2 4 6 18 20 16 14 81012 input output time ( s) voltage (v) figure 18. non?inverting small signal transient response 18.1 18.05 18 17.95 17.9 v s = 36 v a v = +1 r l = 10 k input output voltage (v) time ( s) ?20 0 20 40 figure 19. inverting small signal transient response 18.075 60 18.05 18.025 18 17.975 17.95 17.925 v s = 36 v a v = +1 r l = 10 k time ( s) voltage (v) figure 20. non?inverting large signal transient response 25 ?20 0 20 40 60 20 15 10 input output v s = 36 v a v = +1 r l = 10 k 10 100 1k 10k 100k 1m ?20 0 20 40 60
ncs20071, ncs20072, NCS20074 http://onsemi.com 15 24 22 20 18 16 14 12 10 input output voltage (v) time ( s) ?20 0 20 40 figure 21. inverting large signal transient response 60 v s = 36 v a v = ?1 r l = 10 k 1200 current (pa) temperature ( c) ?25 0 25 50 figure 22. input bias and offset current vs. temperature 125 100 75 1000 800 600 400 200 0 ?200 i ib + i ib ? i os v s = 36 v 50 current (pa) common mode voltage (v) 0 6 12 30 figure 23. input bias current vs. common mode voltage 36 i ib + i ib ? i os v s = 36 v 40 30 20 10 0 ?10 ?20 ?30 ?40 ?50 24 18 2 v/div time (s) 012 5 figure 24. 0.1 hz to 10 hz noise 10 8 7 34 6 9 0.1 hz to 10 hz noise v s = 18 v, v cm = v s /2 r l = 10 k , c l = 100 pf a v = ?1, v in = 0 v v s = 2.7 v v s = 5 v v s = 10 v v s = 36 v 0 channel separation (db) frequency (hz) figure 25. channel separation vs. frequency ?20 ?40 ?60 ?80 ?100 ?120 ?140 ?160 r l = 10 k c l = 25 pf v s = 2.7 v v s = 5 v v s = 10 v v s = 36 v 500 impedance ( ) frequency (hz) figure 26. open loop output impedance 450 400 350 300 250 200 150 100 50 0 10 100 1k 10k 100k 1m 10 100 1k 10k 100k 1m
ncs20071, ncs20072, NCS20074 http://onsemi.com 16 1000 offset voltage ( v) temperature ( c) ?50 ?25 0 75 figure 27. offset voltage vs. temperature 100 50 25 500 0 ?500 ?1000 ?1500 ?2000 ?2500 v s = 36 v 5 units v cm = mid?supply 125 10 from final value (mv) time ( s) 0 5 10 15 figure 28. large signal settling time 45 30 25 50 8 6 4 2 0 ?2 ?4 ?6 ?8 ?10 20 35 40 v s = 36 v 10 v step a v = ?1 12?bit setting 1/2lsb = 0.024% sr+ sr? 5 slew rate (v/ s) temperature ( c) ?40 ?20 0 60 figure 29. slew rate vs. temperature 100 40 20 120 4 3 2 1 0 80 v s = 36 v
ncs20071, ncs20072, NCS20074 http://onsemi.com 17 package dimensions sot?553, 5 lead case 463b issue c e m 0.08 (0.003) x b 5 pl a c ?x? ?y? notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. d e y 12 3 4 5 l 1.35 0.0531 0.5 0.0197 mm inches scale 20:1 0.5 0.0197 1.0 0.0394 0.45 0.0177 0.3 0.0118 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h e dim a min nom max min millimeters 0.50 0.55 0.60 0.020 inches b 0.17 0.22 0.27 0.007 c d 1.55 1.60 1.65 0.061 e 1.15 1.20 1.25 0.045 e 0.50 bsc l 0.10 0.20 0.30 0.004 0.022 0.024 0.009 0.011 0.063 0.065 0.047 0.049 0.008 0.012 nom max 1.55 1.60 1.65 0.061 0.063 0.065 h e 0.08 0.13 0.18 0.003 0.005 0.007 0.020 bsc recommended
ncs20071, ncs20072, NCS20074 http://onsemi.com 18 package dimensions tsop?5 case 483?02 issue k notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 per side. dimension a. 5. optional construction: an additional trimmed lead is allowed in this location. trimmed lead not to extend more than 0.2 from body. dim min max millimeters a 3.00 bsc b 1.50 bsc c 0.90 1.10 d 0.25 0.50 g 0.95 bsc h 0.01 0.10 j 0.10 0.26 k 0.20 0.60 m 0 10 s 2.50 3.00 123 54 s a g b d h c j 0.7 0.028 1.0 0.039 mm inches scale 10:1 0.95 0.037 2.4 0.094 1.9 0.074 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.20 5x c ab t 0.10 2x 2x t 0.20 note 5 c seating plane 0.05 k m detail z detail z top view side view a b end view
ncs20071, ncs20072, NCS20074 http://onsemi.com 19 package dimensions micro8 / msop8 (150 mil) case 846ah issue a soldering footprint* note: the measurements are not to guarantee but for reference only. (unit: mm) *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 1.0 4.30 0.35 0.65
ncs20071, ncs20072, NCS20074 http://onsemi.com 20 package dimensions soic?8 nb case 751?07 issue ak seating plane 1 4 5 8 n j x 45 k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 6. 751?01 thru 751?06 are obsolete. new standard is 751?07. a b s d h c 0.10 (0.004) dim a min max min max inches 4.80 5.00 0.189 0.197 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.053 0.069 d 0.33 0.51 0.013 0.020 g 1.27 bsc 0.050 bsc h 0.10 0.25 0.004 0.010 j 0.19 0.25 0.007 0.010 k 0.40 1.27 0.016 0.050 m 0 8 0 8 n 0.25 0.50 0.010 0.020 s 5.80 6.20 0.228 0.244 ?x? ?y? g m y m 0.25 (0.010) ?z? y m 0.25 (0.010) z s x s m 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 mm inches scale 6:1 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint*
ncs20071, ncs20072, NCS20074 http://onsemi.com 21 package dimensions tssop?8 case 948s issue c dim min max min max inches millimeters a 2.90 3.10 0.114 0.122 b 4.30 4.50 0.169 0.177 c --- 1.10 --- 0.043 d 0.05 0.15 0.002 0.006 f 0.50 0.70 0.020 0.028 g 0.65 bsc 0.026 bsc l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash. protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. terminal numbers are shown for reference only. 6. dimension a and b are to be determined at datum plane -w-. seating plane pin 1 1 4 85 detail e b c d a g l 2x l/2 ?u? s u 0.20 (0.008) t s u m 0.10 (0.004) v s t 0.076 (0.003) ?t? ?v? ?w? 8x ref k ident k 0.19 0.30 0.007 0.012 s u 0.20 (0.008) t detail e f m 0.25 (0.010) ??? ??? ??? k1 k jj1 section n?n j 0.09 0.20 0.004 0.008 k1 0.19 0.25 0.007 0.010 j1 0.09 0.16 0.004 0.006 n n
ncs20071, ncs20072, NCS20074 http://onsemi.com 22 package dimensions udfn8, 1.6x1.6, 0.4p case 517ac issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.25 and 0.30 mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. 5. exposed pads connected to die flag. used as test contacts. a b e d d2 e2 bottom view b e 8x 0.10 b 0.05 a c c k 8x note 3 2x 0.10 c pin one reference top view 2x 0.10 c 8x a a1 (a3) 0.08 c 0.10 c c seating plane side view l 8x 1 4 5 8 dim min nom max millimeters a 0.45 0.50 0.55 a1 0.00 0.03 0.05 a3 0.127 ref b 0.15 0.20 0.25 d 1.60 bsc d2 0.70 0.80 0.90 e 1.60 bsc e2 0.40 0.50 0.60 e 0.40 bsc k 0.20 ??? ??? l 0.20 0.30 0.40 (a3) *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* mm inches scale 20:1 0.902 0.0355 0.924 0.0364 0.490 0.0193 0.400 0.0157 pitch 0.502 0.0197 0.200 0.0079
ncs20071, ncs20072, NCS20074 http://onsemi.com 23 package dimensions tssop?14 case 948g issue b dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c ??? 1.20 ??? 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane ?w?. s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l ?u? seating plane 0.10 (0.004) ?t? ??? ??? 0.25 (0.010) 8 14 7 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t ?v? 14x ref k n n 7.06 14x 0.36 14x 1.26 0.65 dimensions: millimeters 1 pitch soldering footprint* *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
ncs20071, ncs20072, NCS20074 http://onsemi.com 24 package dimensions soic?14 nb case 751a?03 issue k notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b does not include dambar protrusion. allowable protrusion shall be 0.13 total in excess of at maximum material condition. 4. dimensions d and e do not include mold protrusions. 5. maximum mold protrusion 0.15 per side. h 14 8 7 1 m 0.25 b m c h x 45 seating plane a1 a m s a m 0.25 b s c b 13x b a e d e detail a l a3 detail a dim min max min max inches millimeters d 8.55 8.75 0.337 0.344 e 3.80 4.00 0.150 0.157 a 1.35 1.75 0.054 0.068 b 0.35 0.49 0.014 0.019 l 0.40 1.25 0.016 0.049 e 1.27 bsc 0.050 bsc a3 0.19 0.25 0.008 0.010 a1 0.10 0.25 0.004 0.010 m 0 7 0 7 h 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.019 6.50 14x 0.58 14x 1.18 1.27 dimensions: millimeters 1 pitch soldering footprint* *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s pr oduct/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 ncs20071/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative

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